Inside Intel's chip labs: how semiconductors will evolve for AI

Dwaresh Patel spent two days at Intel's advanced fabrication facility to understand the future of semiconductor design. The video breaks down emerging chip technologies—gate-all-around transistors, backside power delivery, CFET, and hybrid bonding—with animated explainers and interviews with Intel's technical leadership.

A key finding: AI compute demand has grown 3x annually over the past decade, but Intel's production capacity could only double even with all available chipmaking tools globally. The episode explores how foundries might extend the gap between surging AI demand and chip supply through various manufacturing techniques and optimization strategies.